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  • All voting closes on 12th March 2018.
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Substrates and Materials Award

Great substrates and high-quality materials are key ingredients for making state-of-the-art devices. This award aims to showcase breakthroughs in this field, such as increases in the size or crystal quality of substrates, the unveiling of new materials, and the introduction of precursors with greater levels of purity.

1400 V GaN-on-Silicon Epiwafers ALLOS Semiconductors

GF125 Series Brook Instruments

200 mm GaN on-QST Substrates Kyma Technologies

150 mm SiC Substrates Norstel AB

SiC Epiwafer Sumitomo Electric

Metrology Award

Measurements of substrates, epiwafers and devices are essential to manufacturing. This is needed to unveil problems with processes, ensure high yields and enable the delivery of products complying with specifications. This award will be contested by companies that offer specialist measurement services; and manufacturers of metrology equipment that either offer a new insight into materials, or set a new benchmark for the time taken for material characterisation.

Fast-Loop Characterization for GaN Power IMS Chips

Zeta Optical Profiler for Patterned Sapphire Substrate Metrology KLA-Tencor Corporation

UVISEL Plus-Modular Ellipsometer Horiba Scientific

European Test Lab for Power Components Rohm Semiconductor

High-volume Manufacturing Award

Compound semiconductor chips − in the form of lasers, LEDs, solar cells, and power and RF devices – are having an impact in all our lives because they are produced in high-volumes at acceptable prices.This award will highlight the biggest successes in high-volume manufacture, including the tools and fabs delivering very high throughput with high yields, and milestones in product manufacture.

ALD Throughput Revolution in More than Moore Wafer Processing Beneq Oy

150 million wafers Monocrystal, Inc

Ramping GaN Chip Capacity with TSMC And Amkor Navitas Semiconductor

200 mm GaN-on-Silicon Micro-LED Wafers Veeco And Allos

Device Design and Packaging Award

The hallmarks of a great product include an optimally designed chip, housed in a package that propels performance to a new level. This award is open to any company contributing to the manufacture of commercial, packaged chips delivering ground-breaking performance.

Co-Packaging Platform for Electronics and Optics POET

All-SiC Modules for High Voltage Applications Wolfspeed

Deep UV LEDs Have Highest Output Power Dowa Electronic Materials

Innovation Award

It is the great ideas of today that can shape the technology of tomorrow. This award celebrates the success of researchers that are inventing new types of device, or taking existing devices to breath-taking performance levels.

Sekidenko MXE High-Speed Pyrometer Advanced Energy

Trimming Losses in GaN Gate Injection Transistors utilizing Bulk GaN Substrates Panasonic Corporation

Mobile Wi-Fi iFEM Qorvo

GENxcel R&D MBE System Veeco

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